Abrasive Black Sic Silicon Carbide For Grinding

1, Preparation process of silicon carbide
Silicon carbide (SiC) is prepared by melting high-purity silica sand (SiO ₂) and carbon (C) at temperatures above 2500 ℃ in an electrode furnace. This process belongs to high-temperature synthesis reaction, and the specific principle is:
Raw materials: high-purity silica sand (providing silicon element) and carbon (usually coke, etc.).
Reaction conditions: Ultra high temperature (>2500 ℃) inside the electrode furnace, melting is achieved through resistance heating.
Product characteristics: The generated silicon carbide is the material with the highest hardness among existing sandblasting media. High quality silicon carbide abrasive is in the form of block shaped particles, which are easily broken and form abrasive particles with sharp edges, suitable for sandblasting operations.

Table 1 Particle size range and chemical composition of silicon carbide for kiln furniture

Table 2 Particle Size Distribution of Silicon Carbide Fine Section for Kiln Furniture

2, Performance advantages of silicon carbide
High hardness: As a superhard material, the sandblasting efficiency is much higher than that of soft abrasives such as quartz sand, greatly reducing the sandblasting time.
Fast cutting speed: The sharp edge structure enables it to have efficient material removal capabilities in scenarios such as grinding and polishing.
Strong recyclability: Compared to traditional sand materials, silicon carbide abrasives can be recycled multiple times, reducing costs.
3, Application areas of silicon carbide
Application direction, specific scenarios, and functions
1. Grinding of high-speed steel and high carbon steel utilizes the high hardness characteristics to perform precision grinding on high-strength steel, improving surface accuracy and smoothness.
2. Advanced refractory materials are used to manufacture blast furnace linings, refractory bricks, etc. due to their high temperature resistance and corrosion resistance, and are resistant to high temperature erosion in the metallurgical industry.
3. Grinding tools and abrasive tools for making grinding wheels, sandpapers, grinding pastes, etc., suitable for processing hard and brittle materials such as hard alloys and ceramics.
4. Grinding and polishing are used for surface treatment of precision components such as semiconductor wafers and optical glass, achieving nanometer level smoothness.
5. In the field of ceramics, as a structural ceramic raw material (such as silicon carbide ceramics), it is used to manufacture high-temperature resistant and wear-resistant mechanical parts (such as sealing rings and turbine blades).
6. The LED industry serves as a substrate material (such as SiC substrate) to support the growth of LED chips, improve device heat dissipation performance and stability.
7. Sandblasting treatment is used as a sandblasting medium to clean the oxide layer, coating or rust on metal surfaces, or for surface roughening treatment (such as pre-treatment of aviation parts).
8. Aerospace is used to manufacture high-temperature resistant components (such as engine nozzles) and lightweight structural parts, meeting the high strength and weather resistance requirements of aviation materials.
9. As an abrasive in wire cutting fluid, wire cutting machining assists in cutting hard metals or semiconductor materials, improving machining accuracy.
10. Photovoltaics and solar energy are used for processes such as silicon wafer cutting and surface texturing of solar cells to improve the light absorption efficiency of solar cells; Or as a substrate material for new photovoltaic devices.
 

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